Strain reduced structure for IC packaging

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United States of America Patent

PATENT NO 9806042
SERIAL NO

13448217

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Abstract

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A semiconductor device includes a semiconductor die having first and second conductive pads, and a substrate having third and fourth bonding pads. A width ratio of the first conductive pad over the third bonding pad at an inner region is different from a width ratio of the second conductive pad over the fourth bonding pad at an outer region.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Wei Hsinchu, TW 909 8139
Chen, Ying-Ju Tuku Township, TW 186 1206
Chen, Yu-Feng Hsinchu, TW 116 941
Wang, Tsung-Ding Tainan, TW 118 2815
Yu, Tsung-Yuan Taipei, TW 108 872

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