Solder sealing in high-power laser devices

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United States of America Patent

PATENT NO 9843164
SERIAL NO

15006733

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Abstract

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In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.

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Patent Owner(s)

Patent OwnerAddress
WBC PHOTONICS INC30 UPTON DRIVE SUITE 4 WILMINGTON MA 01887

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deutsch, Michael Derry, US 31 287
Tayebati, Parviz Sherborn, US 181 3284

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