Method for manufacturing a microphone

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9998843
APP PUB NO 20160157038A1
SERIAL NO

15018625

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chun-wen Zhubei, TW 253 3389
Cho, Chin-Yi Kaohsiung, TW 11 26
Chu, Chia-Hua Zhubei, TW 190 2474
Huang, Yao-Te Hsinchu, TW 54 393
Hung, Li-Min Longtan Township, TW 15 52
Peng, Jung-Huei Jhubei, TW 101 1111

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