Method for fabricating ceramic insulator for electronic packaging

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United States of America Patent

PATENT NO 9999125
APP PUB NO 20170257946A1
SERIAL NO

15602137

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Abstract

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The present application discloses a method for fabricating ceramic insulator for electronic packaging, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.

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Patent Owner(s)

Patent OwnerAddress
HE BEI SINOPACK ELECTRONIC TECH CO LTD050000 NO 21 CHANGSHENG STREET LUQUAN ECONOMIC DEVELOPMENT ZONE SHIJIAZHUANG CITY HEBEI PROVINCE SHIJIAZHUANG CITY HEBEI PROVINCE 050000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Fei Shijiazhuang, CN 52 170
Liu, Linjie Shijiazhuang, CN 4 0
Zhao, Dongliang Shijiazhuang, CN 12 34

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