Copper deposition in wafer level packaging of integrated circuits

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United States of America Patent

PATENT NO 11697884
SERIAL NO

17400633

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Abstract

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An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

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Patent Owner(s)

  • MACDERMID ENTHONE INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Commander, John Old Saybrook, US 13 41
Hurtubise, Richard Clinton, US 35 301
Paneccasio,, Jr Vincent Madison, US 25 144
Richardson, Thomas Killingworth, US 163 3124
Whitten, Kyle Hamden, US 16 15

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