Circuit module and process for producing the same
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United States of America Patent
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Jun 15, 2010
Issued Date -
N/A
app pub date -
Jan 17, 2008
filing date -
Jun 28, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
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