Semiconductor package-on-package system including integrated passive components
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United States of America Patent
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Aug 4, 2009
Grant Date -
Nov 1, 2007
app pub date -
May 1, 2006
filing date -
May 1, 2006
priority date (Note) -
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Abstract
A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.
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