Method of manufacturing low CTE substrates for use with low-k flip-chip package devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 17, 2009
Grant Date -
Apr 19, 2007
app pub date -
Dec 14, 2006
filing date -
Jul 7, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed are techniques that teach the replacement of the typical organic, plastic, or ceramic package substrate used in semiconductor package devices with a low-CTE package substrate. In one embodiment, a semiconductor device implementing the disclosed techniques is provided, where the device comprises an integrated circuit chip having at least one coupling component formed on an exterior surface thereof. Also, the device includes a package substrate having a mounting surface with bonding pads that are configured to receive the at least one coupling component. In such embodiments, the package substrate is selected or manufactured such that it has a coefficient of thermal expansion in a direction perpendicular to its mounting surface that is less than approximately twice a coefficient of thermal expansion along a plane parallel to its mounting surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully