Method and apparatus for measuring thickness and optical properties of a thin-film on a substrate
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United States of America Patent
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Feb 17, 2009
Grant Date -
N/A
app pub date -
Jun 26, 2007
filing date -
Jun 26, 2006
priority date (Note) -
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Abstract
Various embodiments include a metrology tool comprising an emitter configured to emit an incident light beam at a production substrate including an ARL, a receiver configured to receive a reflected light beam from the production substrate, a spectrometer configured to determine a digital signal representing an intensity of a wavelength within the reflected light beam, and a processor configured to determine a spectrum of the reflected light beam from the digital signal, select a suppression band based on an expected wavelength representative of a portion of the ARL, and determine a property of the ARL based on a portion of the spectrum in the selected suppression band.
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