Composition for removing conductive materials and manufacturing method of array substrate using the same
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United States of America Patent
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Mar 30, 2010
Grant Date -
Dec 28, 2006
app pub date -
Jun 14, 2006
filing date -
Jun 28, 2005
priority date (Note) -
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Abstract
A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.
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