Method of producing electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 2, 1991
Grant Date -
N/A
app pub date -
Mar 5, 1990
filing date -
Mar 7, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.
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