Semiconductor device and method for fabricating the same
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United States of America Patent
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May 11, 2004
Grant Date -
Aug 28, 2003
app pub date -
Jul 31, 2002
filing date -
Feb 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A group of wires that bonds the first semiconductor chip and the second semiconductor chip together and extends on the first semiconductor chip is formed of a single plated film through plating in one continuous process. The second semiconductor chip is then bonded onto the first semiconductor chip to complete a semiconductor package.
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